2026
The 7th International Conference on Engineering, Physics, MEMS-Biosensors and Applications
VNUHCM-University of Science · Grand Palace Hotel (Vung Tau Ward) · BRVT University
Ho Chi Minh City, Vietnam
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Where Science Meets Application
The 7th International Conference on Engineering, Physics, MEMS-Biosensors and Applications (ICEBA 2026) aims to link researchers and scientists globally in the fields of engineering, physics, microelectronics, and semiconductors.
Subject Areas
Explore the cutting-edge research tracks shaping the future of engineering and physics.
Applied Physics, Engineering Physics, Electronic Engineering
Optics & Photonics, Earth Sciences and Related
Thin Film Optics, Optical Engineering and Vacuum technologies
Semiconductors, MEM-Biosensors and Applications
Biomedical Engineering, Bio-devices and Healthcare Technologies
Microelectronics, IC design, low consumption devices, Renewable Energy
Computing Science, Simulations and Modeling
Embedded systems, IoT, method of Machine Learning, Artificial Intelligence, etc.
Medical Physics and Nuclear Engineering
Robotic, Automation and Intelligent System
Life Science
Smart cities and smart transportation system
Intelligent System in Logistics and Harbor design, Contractor and Maintenance
Co-organizers
A strategic alliance between leading academic institutions and industrial pioneers in the semiconductor sector.
University of Science - Vietnam National University Ho Chi Minh City, Vietnam
Tohoku University, Sendai, Miyagi, Japan
Ho Chi Minh City Semiconductor Industrial Association, Vietnam
SHTP Lab, Saigon Hi-Tech Park, Vietnam
IEEJ-TEEE-Sensors and Micromachines Section, Japan
Ba Ria – Vung Tau University (BVU), Vietnam
Host
Associated Organizations: 9+
- National Central University, Taiwan;
- National Chung Hsing University, Taiwan;
- Research Center for Applied Sciences, Academia Sinica, Taiwan;
- KFUPM University, Saudi Arabia;
- King Mongkut's Institute of Technology Ladkrabang (BKK, Thailand);
- Universiti Malaya, Malaysia;
- Universiti Tunku Abdul Rahman, Malaysia;
- VN-UK Institute For Research and Executive Education (VNUK);
- Digisensor JSC, SHTP, Vietnam;
Will be updated
Technical supports:
Springer Nature Singapore Pte Ltd.
Institute of Electrical Engineers of Japan
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Physical Society of Taiwan
Tạp chí Xây dựng
Conference Highlights
Don't miss these key events at ICEBA 2026. From the opening ceremony to our gala dinner, we have an exciting program prepared.
Important Dates
before 08 June 2026
Submit and upload abstract
15 June 2026
Abstract notification
before 15 July 2026
Last extend Abstract & Full manuscript submission
1 August 2026
Manuscript notification
01 September 2026
Final manuscript submission
before 15 September 2026
Early registration
15 October 2026
Program notifications
2,3&4 November 2026
Conference day
before 15 November 2026
Reviewing Process
After 1 December 2026
Publication
Registration Fees
Regular Author / Delegate
Student (with Valid ID)
Fee includes: ICEBA booklet, coffee break, lunch, welcome/farewell parties, local transportation and Publication (except of IEEJ-TEEE Journal). Invited speakers and committee members are free of charge.
Publication of ICEBA 2026
Accepted and presented papers will be published in the Proceedings (Springer Nature, Scopus). Selected high-quality papers will be recommended for the following journals (indexing levels differ).
Springer Nature Singapore — Proceedings
Proceeding of ICEBA2026 — Book Series of Springer Nature, Singapore. Indexed in Scopus.
Chinese Journal of Physics (CJP)
Physical Society of Taiwan. Q1/Q2 journal indexed in Scopus/WoS. Special issue for ICEBA2026.
IEEJ Transactions on Electrical and Electronic Engineering
IEEJ-TEEE — Q3 journal indexed in Scopus, Japan. Special issue for ICEBA2026.
Journal of Construction (Tạp chí Xây dựng), Vietnam
Ministry of Construction, Vietnam. Recognized by the State Professor Council (GSNN).
Conference Speakers
We are honored to host world-renowned experts who will share their latest findings and vision for the future of engineering and physics.
Plenary Speakers
Assoc. Prof. Huynh Thanh Dat
Former Minister, Ministry of Science and Technology, Vietnam
Major Directions for Scientific and Technological Research and Innovation in the Field of Electronics and Semiconductor Microchips in Vietnam (2025–2035, Vision 2045)
Prof. Takahito Ono
Department of Mechanical Systems Engineering, Tohoku University · Co-Director, Micro System Integration Center, Tohoku University, Japan
Magneto-Electromechanical Microsystems Based on Magnetostriction: Integrated Sensors, Actuators, and Spin-mechatronic Transducers
Prof. Dzung Viet Dao
Queensland Quantum and Advanced Technologies Research Institute, Griffith University, Australia
Heterojunction-Based Sensors and Self-Powered Devices: From Silicon to Emerging Semiconductor Materials
Assoc. Prof. Tran Minh Triet
FIT, VNUHCM - University of Science, Vietnam
TBA
Prof. Kyeong Min-Sik
Kookmin University and IKEEE, South Korea
TBA
Mrs. La Thi Thu Hang
General Director, D.G.S Electronic JSC (Digisensor), Saigon Hi-Tech Park, Ho Chi Minh City, Vietnam
Our Digisensor JSC and Its Products
Prof. Hidekuni Takao
Faculty of Engineering and Design · Director, Nano-Micro Structure Device Integrated Research Center, Kagawa University, Japan
Quantifying the Sense of Touch: Nano-Tactile MEMS Sensors for Materials, Healthcare, and Tactile AI
Mr. Nguyen Phuc Vinh
Synopsys Vietnam
TBA
Prof. Hirokazu Tada
Department of Materials Engineering Science, Graduate School of Engineering Science, The University of Osaka · OTRI-Spin, The University of Osaka, Japan
Carrier, Spin and Heat Transport in Single-Molecule Junctions
Invited Speakers
Prof. Yun-Chorng (Jeff) Chang
Academia Sinica, Taiwan
TBA
Prof. Aparporn Sakulkalavek
Department of Physics, School of Science, King Mongkut's Institute of Technology Ladkrabang (KMITL), Thailand
Scalable Flexible Thermoelectrics for Self-Powered IoT and Wearable Thermal Management
Asst. Prof. Dr. Hoai Luan Pham
Nara Institute of Science and Technology (NAIST), Ikoma, Nara, Japan
Energy-Efficient AI Accelerators for Wearable Healthcare Applications
More Invited Speakers will be announced throughout July 2026.
Bridging Tradition & Innovation
ICEBA 2026 symbolizes the strong academic and cultural partnership between Japan and Vietnam.
Japan
Heritage
Vietnam
Vibrancy
A seamless convergence of Japanese academic precision and Vietnamese dynamic growth. Two cultures, one shared vision for the future of engineering.
Memories from Past ICEBA
Highlights from our previous successful editions.
Group Photo
Outstanding Award
Poster Session
